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Pat. 11404356 United States, Int. Cl.22 H01L 23/495, H01L 21/48, H01L 23/31, H02M 3/158. Electronic device with die pad and leads, and method of manufacturing : Appl. N 16/827049 : Filed 23.03.2020 : Pub. 02.08.2022 : / Katsutoki Shirai, Yoshio Higashida ; Assignee Rohm Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11404356/en?oq=US11404356.html (дата обращения: ДД.ММ.ГГГГ).