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Pat. 11437305 United States, Int. Cl.22 H01L 23/495, H01L 23/00, H01L 23/13, H01L 23/52, H01L 25/065, H01L 25/18, H01L 29/739, H01L 29/78, H02M 7/5387. Semiconductor module : Appl. N 16/882990 : Filed 26.05.2020 : Pub. 06.09.2022 : / Shuhei Miyachi, Takaharu Kozawa, Toshihiro Fujita ; Assignee Denso Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11437305/en?oq=US11437305.html (дата обращения: ДД.ММ.ГГГГ).