Библиографическая ссылка на патент
Pat. 11515077 United States, Int. Cl.22 H01F 27/30, H01B 7/04, H01F 1/147, H01F 1/44, H01F 7/04, H01F 27/02, H01F 27/24, H02M 3/04, H02M 7/00. Power magnetic components packaged in otherwise unutilized space of power electronics : Appl. N 16/736275 : Filed 07.01.2020 : Pub. 29.11.2022 : / Jun Kikuchi, Chuanbing Rong, Leyi Zhu ; Assignee Ford Global Technologies LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11515077/en?oq=US11515077.html (дата обращения: ДД.ММ.ГГГГ).