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Pat. 11527357 United States, Int. Cl.22 H01G 2/02, H01G 4/224, H01G 4/228, H01G 4/258, H01G 4/38, H02M 7/00. Busbar with tailored perforation sizes to provide thermal path : Appl. N 17/223366 : Filed 06.04.2021 : Pub. 13.12.2022 : / Hailing Wu, Aritra Sur, Xin Wu ; Assignee Hamilton Sundstrand Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11527357/en?oq=US11527357.html (дата обращения: ДД.ММ.ГГГГ).