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Pat. 11532537 United States, Int. Cl.22 H01L 23/482, H01L 21/50, H01L 21/56, H01L 23/373, H01L 23/498, H01L 23/538, H01L 25/07, H01L 25/11, H01L 25/18, H02M 7/00, H01L 23/00, H01L 23/31. Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold : Appl. N 17/119243 : Filed 11.12.2020 : Pub. 20.12.2022 : / Toshio Hanada ; Assignee Rohm Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11532537/en?oq=US11532537.html (дата обращения: ДД.ММ.ГГГГ).