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Pat. 11538736 United States, Int. Cl.22 H01L 23/473, H01L 23/495, H01L 23/498, H01L 25/065, H02M 7/00, H02M 7/5387, H05K 7/20, H02P 27/06. Cooling apparatus, semiconductor module, and vehicle : Appl. N 17/317776 : Filed 11.05.2021 : Pub. 27.12.2022 : / Nobuhide Arai ; Assignee Fuji Electric Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11538736/en?oq=US11538736.html (дата обращения: ДД.ММ.ГГГГ).