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Pat. 11538741 United States, Int. Cl.22 H01L 23/495, H01L 21/50, H01L 25/065, H01L 25/16, H02M 3/158. Multi-chip module leadless package : Appl. N 17/177910 : Filed 17.02.2021 : Pub. 27.12.2022 : / Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro ; Assignee Texas Instruments Inc ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11538741/en?oq=US11538741.html (дата обращения: ДД.ММ.ГГГГ).