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Pat. 9881852 United States, Int. Cl.22 H01L 23/12, H01L 23/00, H01L 23/31, H01L 23/495, H01L 25/00, H01L 25/07, H01L 25/16, H01L 27/06, H02M 7/537, H02P 27/06. Semiconductor module : Appl. N 15/491028 : Filed 19.04.2017 : Pub. 30.01.2018 : / Mitsunori Kimura, Hiroshi Shimizu, Kengo Mochiki, Yasuyuki Ohkouchi, Yuu Yamahira, Tetsuya Matsuoka, Kazuma Fukushima ; Assignee Denso Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US9881852/en?oq=US9881852.html (дата обращения: ДД.ММ.ГГГГ).