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Pat. 9905541 United States, Int. Cl.22 H01L 25/07, H01L 23/00, H01L 23/04, H01L 23/31, H01L 23/367, H01L 23/492, H01L 23/498, H01L 25/18, H02M 7/5387, H02P 27/06. Semiconductor module with bus bar including stacked wiring layers : Appl. N 15/129860 : Filed 26.03.2015 : Pub. 27.02.2018 : / Hiroshi Ishino, Tomokazu Watanabe ; Assignee Denso Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US9905541/en?oq=US9905541.html (дата обращения: ДД.ММ.ГГГГ).