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Pat. 9935045 United States, Int. Cl.22 H01L 21/44, H01L 21/02, H01L 21/304, H01L 21/3065, H01L 21/308, H01L 21/48, H01L 21/56, H01L 21/66, H01L 21/67, H01L 21/78, H01L 23/00, H01L 23/31, H01L 23/482, H01L 23/495, H01L 23/498, H01L 23/544, H01L 25/00, H01L 25/065, H02M 3/158, H01L 27/146. Semiconductor device and method of forming cantilevered protrusion on a semiconductor die : Appl. N 15/231025 : Filed 08.08.2016 : Pub. 03.04.2018 : / Francis J. Carney, Michael J. Seddon ; Assignee Semiconductor Components Industries LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US9935045/en?oq=US9935045.html (дата обращения: ДД.ММ.ГГГГ).