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Pat. 9960103 United States, Int. Cl.22 H01L 23/482, H01L 21/50, H01L 21/56, H01L 23/373, H01L 23/498, H01L 23/538, H01L 25/07, H01L 25/18, H02M 7/00, H01L 23/00, H01L 23/31. Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold : Appl. N 14/663135 : Filed 19.03.2015 : Pub. 01.05.2018 : / Toshio Hanada ; Assignee Rohm Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US9960103/en?oq=US9960103.html (дата обращения: ДД.ММ.ГГГГ).